Cloud Application

With the global wave of AI driving strong demand for high-performance server platforms from data centers and enterprise users, Chenbro responds to market demands with a new generation of Intel and AMD platform server chassis solutions. These solutions are designed based on the characteristics of Intel and AMD platforms, with the most suitable airflow channels designed accordingly.

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As the internet becomes an indispensable part of people's lives, migrating to the cloud has become a primary strategy for businesses moving towards digital transformation. From multinational corporations to small and medium-sized enterprises, many are adopting public or hybrid cloud solutions, moving local storage space to the cloud, and driving the rapid growth of cloud data storage. Major cloud service providers worldwide continually expand their cloud infrastructure to seize opportunities, with numerous small and medium-sized enterprises also needing to establish cloud centers, rapidly driving the significant demand for cloud servers. Servers must have excellent and stable operational performance to meet the high computing demands for cloud servers. The components carried by the chassis, such as CPU/GPU, motherboard, cooling system, power supply, etc., must be perfectly integrated. Leveraging its robust electromechanical integration capabilities, Chenbro provides various services to end customers, such as cloud service providers, through three modes: OTS standard products, JDM/ODM, and OEM+. The solutions encompass modular, multi-configurable, highly compatible, and highly distinctive electromechanical integration, catering to the diverse needs of different cloud data centers. With the global wave of AI driving strong demand for high-performance server platforms from data centers and enterprise users, Chenbro responds to market demands with a new generation of Intel and AMD platform server chassis solutions. These solutions are designed based on the characteristics of Intel and AMD platforms, with the most suitable airflow channels designed accordingly. In addition, cloud application servers equipped with Gen 5 have a transmission rate twice that of Gen 4 enterprise-grade servers. With various hard drive configuration options, customers can flexibly choose according to their needs. Chenbro's intricate and rigorous design process for cloud server chassis provides high stability and reliability for enterprises and cloud users. Examples include the RB151/RB251 T-Shaped series, pre-equipped with Intel motherboards as quasi-systems suitable for mainstream storage, and the RM151/RM251 L-Shaped series, compatible with both Intel Eagle Stream and AMD Genoa platforms, offering diverse hard drive configurations to meet different application needs.
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